The article details Intel’s strategic pivot to advanced chip packaging as a critical, yet often overlooked, component in the AI hardware race. While much attention is focused on transistor miniaturization, Intel is betting that its expertise in packaging multiple specialized chips (chiplets) into a single, high-performance unit will be a decisive advantage. This approach, using technologies like its Foveros 3D stacking, allows for more powerful and efficient processors by combining different types of silicon optimized for specific tasks. The company is investing heavily in this area, positioning its packaging foundry services as a key offering to other chip designers. If successful, this focus on the ‘back end’ of chip manufacturing could secure Intel a central and highly profitable role in the supply chain for next-generation AI systems. Read the full article: https://www.wired.com/story/why-chip-packaging-could-decide-the-next-phase-of-the-ai-boom/